TDB-DST signs agreement with BigEndian Semiconductors for ₹130 crore RDI support to develop indigenous AI Vision SoC

The Technology Development Board (TDB) under the Department of Science & Technology (DST) has signed an agreement with M/s BigEndian Semiconductors for financial support of ₹130 crore under the Research Development and Innovation (RDI) Fund. The total project cost, named Project VeerAI, is ₹260 crore and aims to advance a camera-focused AI Vision System-on-Chip (SoC) from Technology Readiness Level (TRL)-5 to TRL-9. The financial assistance is provided through Optional Convertible Debt (OCD). The initiative aims to develop secure, application-specific semiconductor solutions for CCTV surveillance, defense, automotive, industrial, and medical domains, thereby reducing reliance on external semiconductor supply chains and promoting domestic technology sovereignty.